Antenna-in-Package Technology and Applications. Duixian Liu. Читать онлайн. Newlib. NEWLIB.NET

Автор: Duixian Liu
Издательство: John Wiley & Sons Limited
Серия:
Жанр произведения: Техническая литература
Год издания: 0
isbn: 9781119556657
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signal‐ground SiGe silicon germanium SiP system‐in‐package SISO single input, single output SIW substrate integrated waveguide SLA stereolithography SLC surface laminar circuit SLM selective laser melting SLS selective laser sintering SMA sub‐miniature version A SNR signal‐to‐noise ratio SoC system on chip SoP system‐on‐package SPDR split post dielectric resonator SPP surface plasmon polariton SRR split‐ring resonator SSD solid state drive SSMA small SMA SUB subtractive process TCB thermocompression bonding TE transverse electric TEM transverse electro‐magnetic TEV through encapsulant via TFMSL thin‐film microstrip line TIM thermal interface material TIV through InFO via TL transmission line TMA thermomechanical analyzer TM transverse magnetic TMV through‐mold vias TPP two‐photo polymerization TSMC Taiwan Semiconductor Manufacturing Company TSOP thin small outline package TSV through silicon via TX transmitter μvia microvia UBM under bump metallurgy UHF ultra‐high frequency UV ultraviolet UWB ultra‐wideband VCO voltage‐controlled oscillator VGA variable gain amplifier VLSI very‐large‐scale integration VNA vector network analyzer VQFN very thin quad flat no‐lead VSWR voltage standing wave ratio WGP wave‐guide port WiGig wireless gigabit alliance WLCSP wafer level chip scale package WLP wafer level package WPAN wireless personal area network WPT wireless power transfer WSN wireless sensor network

      Symbols

Ae effective antenna aperture
c speed of light
D directivity
D = max[D(ϑ, ϕ)] directivity function
η effciency
unit vector along the r axis
electric field in space frequency
f frequency
G gain
G = max[G(ϑ, ϕ)] gain function
Γ reflection coeffcient
I p input current antenna

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