signal‐ground
|
SiGe
|
silicon germanium
|
SiP
|
system‐in‐package
|
SISO
|
single input, single output
|
SIW
|
substrate integrated waveguide
|
SLA
|
stereolithography
|
SLC
|
surface laminar circuit
|
SLM
|
selective laser melting
|
SLS
|
selective laser sintering
|
SMA
|
sub‐miniature version A
|
SNR
|
signal‐to‐noise ratio
|
SoC
|
system on chip
|
SoP
|
system‐on‐package
|
SPDR
|
split post dielectric resonator
|
SPP
|
surface plasmon polariton
|
SRR
|
split‐ring resonator
|
SSD
|
solid state drive
|
SSMA
|
small SMA
|
SUB
|
subtractive process
|
TCB
|
thermocompression bonding
|
TE
|
transverse electric
|
TEM
|
transverse electro‐magnetic
|
TEV
|
through encapsulant via
|
TFMSL
|
thin‐film microstrip line
|
TIM
|
thermal interface material
|
TIV
|
through InFO via
|
TL
|
transmission line
|
TMA
|
thermomechanical analyzer
|
TM
|
transverse magnetic
|
TMV
|
through‐mold vias
|
TPP
|
two‐photo polymerization
|
TSMC
|
Taiwan Semiconductor Manufacturing Company
|
TSOP
|
thin small outline package
|
TSV
|
through silicon via
|
TX
|
transmitter
|
μvia
|
microvia
|
UBM
|
under bump metallurgy
|
UHF
|
ultra‐high frequency
|
UV
|
ultraviolet
|
UWB
|
ultra‐wideband
|
VCO
|
voltage‐controlled oscillator
|
VGA
|
variable gain amplifier
|
VLSI
|
very‐large‐scale integration
|
VNA
|
vector network analyzer
|
VQFN
|
very thin quad flat no‐lead
|
VSWR
|
voltage standing wave ratio
|
WGP
|
wave‐guide port
|
WiGig
|
wireless gigabit alliance
|
WLCSP
|
wafer level chip scale package
|
WLP
|
wafer level package
|
WPAN
|
wireless personal area network
|
WPT
|
wireless power transfer
|
WSN
|
wireless sensor network
|
Symbols
Ae
|
|
effective antenna aperture
|
c
|
speed of light
|
D
|
directivity
|
D = max[D(ϑ, ϕ)]
|
directivity function
|
η
|
effciency
|
|
unit vector along the r axis
|
|
electric field in space frequency
|
f
|
frequency
|
G
|
gain
|
G = max[G(ϑ, ϕ)]
|
gain function
|
Γ
|
reflection coeffcient
|
I
p
|
input current antenna
|
|