Antenna-in-Package Technology and Applications. Duixian Liu. Читать онлайн. Newlib. NEWLIB.NET

Автор: Duixian Liu
Издательство: John Wiley & Sons Limited
Серия:
Жанр произведения: Техническая литература
Год издания: 0
isbn: 9781119556657
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       Library of Congress Cataloging‐in‐Publication data applied for

      ISBN: 9781119556633

      Cover Design: Wiley

      Cover Image: © windwheel/Shutterstock

       Yueping Zhang

      School of Electrical and Electronic Engineering

      Nanyang Technological University

      Singapore

       Ning Ye

      Package Technology Development & Integration

      Milpitas

      USA

       Xiaoxiong Gu

      Thomas. J. Watson Research Center, IBM

      New York

      USA

       Pritish Parida

      Thomas. J. Watson Research Center, IBM

      New York

      USA

       A.C.F. Reniers

      Department of Electrical Engineering

      Eindhoven University of Technology (TU/e)

      Eindhoven

      The Netherlands

       U. Johannsen

      Eindhoven University of Technology (TU/e)

      Eindhoven

      The Netherlands

       A.B. Smolders

      Department of Electrical Engineering

      Eindhoven University of Technology (TU/e)

      Eindhoven

      The Netherlands

       Atif Shamim

      Computer, Electrical and Mathematical Sciences and Engineering Division

      King Abdullah University of Science & Technology (KAUST)

      KSA

       Haoran Zhang

      Computer, Electrical and Mathematical Sciences and Engineering Division

      King Abdullah University of Science & Technology (KAUST)

      KSA

       Frédéric Gianesello

      ST Microelectronics

      Technology R&D

      Silicon Technology Development

      Crolles

      France

       Diane Titz

      Université Nice Sophia Antipolis

      Polytech'Lab

      Biot

      France

       Cyril Luxey

      Université Nice Sophia Antipolis

      Polytech'Lab

      Biot

      France

       Maciej Wojnowski

      Infineon Technologies AG

      Neubiberg

      Germany

       Klaus Pressel

      Infineon Technologies AG

      Regensburg

      Germany

       Tong‐Hong Lin

      The School of Electrical and Computer Engineering

      Georgia Institute of Technology

      Atlanta

      USA

       Ryan A. Bahr

      The School of Electrical and Computer Engineering

      Georgia Institute of Technology

      Atlanta

      USA

       Manos M. Tentzeris

      The School of Electrical and Computer Engineering

      Georgia Institute of Technology

      Atlanta

      USA

       Duixian Liu

      Thomas. J. Watson Research Center, IBM

      New York

      USA

       Amin Enayati

      Emerson & Cuming Anechoic Chambers

      Antwerp Area

      Belgium

       Karin Mohammadpour‐Aghdam

      School of Electrical and Computer Engineering

      University of Tehran

      Iran

       Farbod Molaee‐Ghaleh

      School of Electrical and Computer Engineering

      University of Tehran

      Iran

      Rapid advances in semiconductor and packaging technologies have promoted the development of two system design concepts known as system on chip (SoC) and system‐in‐package (SiP). SoC integrates analog, digital, mixed‐signal, and radio frequency (RF) circuits on a chip by a semiconductor process, while SiP implements separately manufactured functional blocks in a package by a packaging process. SoC yields improved system reliability and functionality at a much lower system cost. However, it degrades system performance and increase system power consumption due to unavoidable compromises in every circuit type in order to use the same material and process. On the contrary, SiP enhances system performance and reduces system power consumption but results in lower system reliability and higher system cost because of functional blocks and the fabrication of the package with different materials and processes.

      Antennas are essential components