Antenna-in-Package Technology and Applications. Duixian Liu. Читать онлайн. Newlib. NEWLIB.NET

Автор: Duixian Liu
Издательство: John Wiley & Sons Limited
Серия:
Жанр произведения: Техническая литература
Год издания: 0
isbn: 9781119556657
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ASIC application‐specific integrated circuit ASUT antenna system under test AUT antenna under test Az azimuth BCB benzocyclobutene BC‐SRR broadside‐coupled SRR BER bit error rate BERT BER tester BiCMOS bipolar complementary metal oxide semiconductor BGA ball grid array BLE Bluetooth low energy BT Bluetooth BT bismaleimide triazine BW bandwidth C4 controlled collapse chip connection CATR compact antenna test range CCL copper‐clad laminate CLIP continuous liquid interface printing CMA characteristic mode analysis CMF conjugate match factor CMG conjugate match gain CMOS complementary metal‐oxide semiconductor CNC computer numerical controlled CP circular polarization CPS coplanar strip CPU central processing unit CPW coplanar waveguide CT computer tomography CTE coefficient of thermal expansion CUF capillary underfill DC direct current DLP digital light projection DMA dynamic mechanical analysis DRAM dynamic random‐access memory DRIE deep reactive ion etching EBG electromagnetic bandgap EIRP equivalent isotropic radiated power El elevation EM electromagnetic EMI electromagnetic interference ESD electrostatic discharge ETS embedded traces eWLB embedded wafer‐level ball grid array EZL embedded Z line FCC Federal Communications Commission FDM fused‐deposition modeling FE front end FF far‐field FMCW frequency modulated continuous wave FoM figure of merit FO PoP fan‐out package‐on‐package FO‐WLP fan‐out wafer‐level packaging FPGA field‐programmable gate array FR4 flame resistant 4 FSS frequency selective surface GaAs gallium arsenide GaN gallium nitride Gb/s gigabit per second GPU graphics processing unit GSG ground‐signal‐ground GSGSG ground‐signal‐ground‐signal‐ground GSM global system for mobile communications HAST highly accelerated stress test HBM high bandwidth memory HDI high‐density integration HDI high‐density interconnect HFSS high‐frequency structure simulator HPBW half‐power beam width HTCC high‐temperature co‐fired ceramics