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IEEE Press
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| Giancarlo Fortino | Andreas Molisch | Diomidis Spinellis | ||
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| Xiaoou Li | Jeffrey Reed | Ahmet Murat Tekalp |
Antenna-in-Package Technology and Applications
Edited by
Duixian Liu
IBM Thomas J. Watson Research Center
New York, USA
Yueping Zhang
School of Electrical and Electronic Engineering
Nanyang Technological University, Singapore
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