Antenna-in-Package Technology and Applications. Duixian Liu. Читать онлайн. Newlib. NEWLIB.NET

Автор: Duixian Liu
Издательство: John Wiley & Sons Limited
Серия:
Жанр произведения: Техническая литература
Год издания: 0
isbn: 9781119556657
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integrated circuits (MMICs) and a small flat antenna in a hermetically sealed package. A window for the propagation of electromagnetic waves is formed above the antenna at the lid of the package. The window is also hermetically sealed.

      A typical AIA consists of active devices such as Gunn diodes or transistors that form an active circuit and a planar antenna. The idea of AIA was proposed to eliminate the lossy and bulky interconnect between the active device and radiating element [10]. Later, the idea of AIA was employed for quasi‐optical power combining. The output power from an array of many solid‐state devices was combined in free space to overcome the power limitations of individual solid‐state devices at mmWave frequencies.

      Although the origin of the above ideas can be traced back to the invention of microstrip antennas in the early 1970s [11], it should be noted that they extended the concept of microstrip antennas to different levels of integration.

      In this section, the early attempts to explore the idea of AiP are reviewed. It should be mentioned that researchers in university labs devoted their efforts regarding Bluetooth radios to 2.4 GHz or other RF applications, while researchers in company labs focused on 60‐GHz radios and other mmWave applications. At 2.4 GHz, a key challenge was how to miniaturize the antenna size, while at 60 GHz, it was how to minimize the interconnect loss between the die and antenna.

      1.3.1 Bluetooth Radio and Other RF Applications

      In 2000, Song et al. at University of Birmingham presented an integrated antenna package [13]. An electrically small feed antenna was designed on a semiconductor substrate, which also supported the RF front‐end circuits. The parasitic radiator placed above the feed antenna also acted as a top cover, sealing the entire package. Later, Song et al. presented another integrated antenna package [14]. A small antenna was embedded within the chip encapsulating material. A parasitic radiator was placed in close proximity to the embedded antenna, where it enhanced the poor gain and bandwidth of the packaged antenna.

      In 2001, package engineers started to tackle the same problem. Lim et al. at the Georgia Institute of Technology managed to integrate RF passives, a patch antenna, and chips at the package level to enhance the overall performance of and to add more functionalities to an SoP paradigm [15]. Mathews et al. disclosed a package with an integral shield and antenna for a complete Bluetooth radio design [16].

      In 2003, Ryckaert et al. at the Interuniversity Microelectronics Center, Belgium reported the co‐design of circular‐polarized slotted patch antenna with a wireless local area network (WLAN) transceiver in a multilayer package [17]. Popov et al. at the Institute of Microelectronics, Singapore reported the design of part of an RF chip package as a dielectric resonator antenna with a high dielectric constant when the antenna feed was integrated with the rest of the circuitry [18]. Leung at City University of Hong Kong independently proposed adding the chip package function to a dielectric resonator antenna in 2004 [19].

      In 2007, Wi et al. at Yonsei University, Korea presented an antenna‐integrated package [23]. A modified U‐shaped slot antenna was designed and measured, showing bandwidth of 180 MHz at 5.8 GHz. A parametric study was conducted with a full‐wave electromagnetic solver to determine the critical factors in design and fabrication, as well as to estimate the performance accuracy of the antenna‐integrated package.

      1.3.2 60‐GHz Radio and Other Millimeter‐wave Applications