Antenna-in-Package Technology and Applications. Duixian Liu

(AR), and gesture radars at 60 GHz, automotive radars at 79 GHz, imagers at 94 GHz, sensors at 122, 145, and 160 GHz, as well as 300‐GHz wireless links. The advantages of AiP technology will continue to generate new applications, for example the adoption of AiP technology in the development of highly integrated micro‐synthetic aperture radar (SAR) for deep‐space exploration [46].

1.5 Concluding Remarks

      AiP technology has broken the boundaries between antenna and circuit fields. The methodology and platform to co‐design antenna and circuits is now available. AiP technology has justified developing new materials and processes, which is rare, to the best of my knowledge, and only microstrip patch antennas have received such attention. Testing has to be considered along the whole manufacturing cycle, including test strategies, verification and characterization, production testing, integration and system level testing. Probe‐based measurement setups are suitable for AiP design verification and characterization. OTA antenna measurements are required for production testing, integration and system level testing. In the future, AiP technology will continue to provide direct antenna solutions to highly integrated wireless systems that will operate at even higher mmWave frequencies. It will also provide parasitic or distributive radiator functions to enhance the terahertz antenna performance of AoC technology.

Acknowledgements

The author is grateful to his students Dr. Wang Junjun, Dr. Sun Mei, Dr. Zhang Bing, Dr. Chen Zihao, Mr. Lin Wei, and Mr. Xue Yang, his research staff Dr. Zhang Wenmei, Dr. Sang‐Hyuk Wi, Dr. Tu Zhihong, and Ms. Zhang Lin, and his collaborators Dr. Duixian Liu and Mr. Brian P. Gaucher of the IBM Thomas J. Watson Research Center and Dr Albert Lu, Mr. Chua Kai Meng, and Ms. Wai Lai Lai of the Singapore Institute of Manufacturing Technology for their contribution in the development of AiP technology.

References

      1 1 B. Song, CMOS RF circuits for data communications applications. IEEE Journal of Solid‐State Circuits, vol. SC‐21, pp. 310–317, February 1986.

      2 2 A. Abidi, A. Rofougaran, G. Chang et al., The future of CMOS wireless transceivers. In ISSCC Digest of Technical Papers, IEEE, February 1997.

      3 3 F. Eynde, J.‐J. Schmit, V. Charlier et al., A fully integrated single‐chip SoC for Bluetooth. In ISSCC Digest of Technical Papers, IEEE, February 2001.

      4 4 S.K. Reynolds, B.A. Floyd, U.R. Pfiffer et al., A silicon 60‐GHz receiver and transmitter chipset for broadband communications. In ISSCC Digest of Technical Papers, IEEE, February 2001.

      5 5 D. Liu, U. Pfeiffer, J. Grzyb, and B. Gaucher (eds.), Advanced Millimeter‐wave Technologies: Antennas, Packaging and Circuits. Wiley, 2009.

      6 6 Y.P. Zhang, Antenna‐in‐package technology: Its early development. IEEE Antennas Propagation Magazine, vol. 61, no. 3, pp. June 2019.

      7 7 K.K. O, K. Kim, B.A. Floyd et al., On‐chip antennas in silicon ICs and their applications. IEEE Transactions on Electron Devices, vol. 52, no. 7, pp. 1312–1323, July 2005.

      8 8 Y. Hirachi, H. Nakano, and A. Kato, A cost‐effective RF‐module with built‐in patch antenna for millimeter‐wave wireless systems. In Proceedings of the European Microwave Conference, Munich, Germany, 5–7 October 1999.

      9 9 https://www.anokiwave.com/ .

      10 10 Y.X. Qian and T. Itoh, Progress in active integrated antennas and their applications. IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 11, pp. 1891–1900, November 1998.

      11 11 R.E. Munson, Conformal microstrip arrays and microstrip phased arrays. IEEE Transactions on Antennas and Propagation, vol. 22, no. 1, pp. 74–78, February 1974.

      12 12 W. Lin, Integrated Circuit Package Antenna, M.Sc. thesis, School of Electrical and Electronic Engineering, Nanyang Technical University, Singapore, 2003.

      13 13 C.T.P. Song, P.S. Hall, H. Ghafouri‐Shiraz et al., Packaging technique for gain enhancement of electrically small antenna designed on gallium arsenide. Electronics Letters, vol. 36, no. 18, pp. 1524–1525, 2000.

      14 14 C.T.P. Song, P.S. Hall, and H. Ghafouri‐Shiraz, Novel RF front end antenna package. IEE Proceedings – Microwaves, Antennas and Propagation, vol. 150, no. 4, pp. 290–294, August 2003.

      15 15 K.T. Lim, A. Obatoyinbo, A. Sutono et al., A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi‐layer packaging technology. In IEEE International Microwave Symposium Digest, Denver, CO, USA, 8–13 June 2001.

      16 16 D.J. Mathews, R.J. Hill, M.P. Gaynor et al., Multi‐chip semiconductor package with integral shield and antenna. US Patent 6686649B1.

      17 17 J. Ryckaert, S. Brebels, B. Come et al., Single‐package 5 GHz WLAN RF module with embedded patch antenna and 20 dBm power amplifier. In IEEE Microwave Symposium Digest, Philadelphia, PA, USA, 8–13 June 2003.

      18 18 A.P. Popov and M.D. Rotaru, A novel integrated dielectric resonator antenna for circular polarization. In Proceedings of the IEEE Electronic Components and Technology Conference New Orleans, LA, USA, 27–30 May 2003.

      19 19 K.W. Leung, The hollow DRA and its novel application as a packaging cover. Hong Kong Research Grants Council, 2004.

      20 20 J.S. Castany, C. Puente, and J. Mumbruforn, Antenna‐in‐package with reduced electromagnetic interaction with on chip elements. US Patent 8330259B2.

      21 21 G. Brzezina, L. Roy, and L. MacEachen, Planar antennas in LTCC technology with transceiver integration capability for ultra‐wideband application. IEEE Transactions on Microwave Theory and Techniques, vol. 54, no.6, pp. 2830–2839, June 2006.

      22 22 M. Sun, Y.P. Zhang, and Y.L. Lu, Ultra‐wideband integrated circuit package antenna in LTCC. In Proceedings of the Asia Pacific Microwave Conference, Yokohama, Japan, 12–15 December 2006.

      23 23 S.H. Wi, J.‐S. Kim, N.‐K. Kang et al., Package‐level integrated LTCC antenna for RF package application. IEEE Transactions on Advanced Packaging, vol. 30, no. 1, pp. 132–141, February 2007.

      24 24 U.R. Pfeiffer, J. Grzyb, D. Liu et al., A chip‐scale packaging technology for 60‐GHz wireless chipsets. IEEE Transactions on Microwave Theory and Techniques, vol. 54, no. 8, pp. 3387–3397, August 2006.

      25 25 N. Shino, H. Uchimura, and K. Miyazato, 77GHz band antenna array substrate for short range car radar. In Proceedings of the IEEE International Microwave Symposium Digest, Long Beach, CA, USA, 12–17 June 2005.

      26 26 Y.P. Zhang, Antenna‐in‐package (AiP) technology for modern radio systems. In Proceedings of the IEEE International Workshop on Antenna Technology, New York, USA, 6–8 March 2006.

      27 27 Y.P. Zhang, M. Sun, K.M. Chua et al., Antenna‐in‐package in LTCC for 60‐GHz radio. In Proceedings of the IEEE International Workshop on Antenna Technology, Cambridge, UK, 21–23 March, 2007.

      28 28 http://www.sibeam.com/

      29 29 Y.P. Zhang, Integrated circuit package antenna: An elegant antenna solution for single‐chip RF transceiver. In Proceedings of the Antenna Systems and Short‐Range Wireless Conference, Santa Clara, CA, USA, 22–23 September 2005.

      30 30 https://www.cadence.com/

      31 31 A. Panther, A. Petos, M.G. Stubbs et al., A wideband array of stacked patch antennas using embedded air cavities in LTCC. IEEE Microwave and Wireless Components Letters, vol. 15, no. 12, pp. 916–918, December 2005.

      32 32 Y.P. Zhang and M. Sun, Grid array antennas and an integration structure, US Patent 8842054B2.

      33 33 https://www.ieeeaps.org/about-the-transactions/best-paper-awards