integrated circuit
IEEE
Institute of Electrical and Electronics Engineers
IF
intermediate frequency
InFO_PoP
integrated fan out package on package
I/O
input/output
IoT
Internet of Things
ISM
industrial, scientific and medical
ISSCC
International Solid‐State Circuits Conference
JPL
jet propulsion laboratory
LCD
liquid crystal display
LCP
liquid crystal polymer
LGA
land grid array
LHCP
left‐hand circular polarization
LNA
low‐noise amplifier
LP
linearly polarized
LTCC
low‐temperature co‐fired ceramic
MACM
multiple amplitude component method
MAPCM
multiple amplitude phase component method
MCM
multi‐chip module
MEMS
micro‐electromechanical systems
MIM
metal–insulator–metal
MIMO
multiple input multiple output
MMIC
monolithic microwave integrated circuit
MMWAC
mmWave anechoic chamber
mmWave
millimeter‐wave
mSAP
modified semi‐additive process
MUF
molded underfill
NF
near‐field
NF
noise figure
NIST
National Institute of Standards and Technology
NRE
non‐recurring engineering
NRW
Nicholson–Ross–Weir
OTA
over‐the‐air
PAE
power‐added efficiency
PAM
phase amplitude method
PBO
polybenzoxazoles
PCB
printed circuit board
PEC
perfect electric conductor
PER
packet error rate
PET
polyethylene terephthalate
pHEMT
pseudomorphic high electron mobility transistor
PI
polyimide
PLA
polylactic acid
PLL
phase‐locked loop
PMC
perfect magnetic conductor
PP
polypropylene
PPM
polarization pattern method
PTH
plated‐through‐hole
p.u.l.
per unit length
QFN
quad flat non‐leaded
QFP
quad flat package
R&D
research and development
RAM
random‐access memory
RCC
resin‐coated copper
RCS
radar cross‐section
RDL
redistribution layer
RF
radio frequency
RFIC
radio frequency integrated circuit
RFID
radio‐frequency identification
RHCP
right‐hand circular polarization
RLCG
resistance, inductance, capacitance, and conductance
RMS
root mean square
RoHS
Restriction of Hazardous Substances Directive
RSM
rotating source method
RX
receiver
SAM
scanning acoustic microscopy
SAP
semi‐additive process
SAR
synthetic aperture radar
SEM
scanning electron microscopy
