7 Chapter 11Table 11.1 Total number of devices in the TFT process.Table 11.2 Cpk and MAPEP values of Cases 1 and 2.Table 11.3 ACF and PACF.Table 11.4 Significance of predictors.Table 11.5 ACF and PACF.Table 11.6 Significance of predictors.Table 11.7 WIP tracking of Spin‐1 sizing percentage with the PDT mechanism.
List of Illustrations
1 Chapter 1Figure 1.1 ISMT e‐Manufacturing hierarchy.Figure 1.2 Four key components for the advanced e‐Manufacturing model.Figure 1.3 MES operation procedures.Figure 1.4 Functional architecture of the ISMT CIM framework.Figure 1.5 The HMES framework. Figure 1.6 ESCM architecture and key processes.Figure 1.7 Functional‐block diagram of the holonic supply‐chain system.Figure 1.8 The ISMT EES framework.Figure 1.9 The proposed EES framework.Figure 1.10 Comparison of SC and EC.Figure 1.11 Engineering‐chain‐management system framework.Figure 1.12 Changing curves of yield and cost during the product life cycle....Figure 1.13 Five‐stage strategy for increasing yield in RD/ramp‐up and MP ph...Figure 1.14 Production line of the bumping process.
2 Chapter 2Figure 2.1 Fundamental steps for developing an intelligent application.Figure 2.2 An external data acquisition system for acquiring process and met...Figure 2.3 Relative motion between a cutting tool and a workpiece.Figure 2.4 Installation of a Dynamometer.Figure 2.5 Installation of a CT.Figure 2.6 Installation of accelerometer by stud mounting.Figure 2.7 Vibration data collection of Z‐axis.Figure 2.8 Installation of thermal couple.Figure 2.9 Distance between a thermal couple and spindle.Figure 2.10 Installation of an AE sensor.Figure 2.11 Sensor fusion system comprising an accelerometer and a thermal c...Figure 2.12 Sensor fusion system using five types of sensors.Figure 2.13 An external data acquisition system triggered by electronic rela...Figure 2.14 An DC signal: (a) in time‐domain; (b) in frequency‐domain; (c) i...Figure 2.15 A random signal: (a) in time‐domain; (b) in frequency‐domain; (c...Figure 2.16 Three‐level decomposition tree of the DWT.Figure 2.17 View of the time and frequency domains.Figure 2.18 A vibration signal: (a) in time‐domain; and (b) in FFT spectrum....Figure 2.19 Unchanged resolution of STFT time‐frequency plane.Figure 2.20 Dynamic window of WPT time‐frequency plane.Figure 2.21 WPT decomposition binary tree.Figure 2.22 Architecture of the AEN.Figure 2.23 Using a smart tool holder to detect tool state.Figure 2.24 Detrending of the thermal effect in strain‐gauge data: (a) befor...Figure 2.25 De‐noising signals to highlight differences between dry‐run and ...Figure 2.26 Collected vibration signals (including idling and machining peri...Figure 2.27 Comparison of the original and decoded features under four idlin...Figure 2.28 Automated segmentation of machining signals using an AEN: (a) di...Figure 2.29 Comparison of time‐domain signals (upper portion), WPT features ...Figure 2.30 WPT distribution results for different cutting depths in the X a...Figure 2.31 Comparison of four SFs extracted by using an AEN for samples of ...Figure 2.32 A forging load (pressure)‐stroke curve.Figure 2.33 Failure diagnosis in a forming process.Figure 2.34 Sample validation using the single dimension feature of the midd...Figure 2.35 AEN‐DNN architecture for failure diagnosis.
3 Chapter 3Figure 3.1 SECS block.Figure 3.2 Block transfer.Figure 3.3 Multi‐block message (677 data bytes).Figure 3.4 Illustration of system bytes.Figure 3.5 Block transfer protocol in a multi‐block message.Figure 3.6 T1, T2, and T3 timeouts.Figure 3.7 Example of T2 timeout and retry limit.Figure 3.8 Equipment is Master and Host is Slave.Figure 3.9 Primary and secondary messages.Figure 3.10 SECS‐II message detail of host sending S1F3 to equipment.Figure 3.11 SECS‐II message detail of Equipment sending S1F4 to Host.Figure 3.12 Message detail style.Figure 3.13 Message structure receiving S1F3.Figure 3.14 Message structure sending S1F4.Figure 3.15 Scopes of GEM, SECS‐II, and other communications alternatives.Figure 3.16 Subsidiary standards of HSMS.Figure 3.17 SECS‐I